20B007 polishing carrier/lapping carrier

polishing carrier/lapping carrier/epoxy resin board/auxiliary grinding plate Characterists: has very excellent characterists of strength and abrasion resistance, planeness, parallelism ect.Usages: widely use for grinding and polishing piezo-crystal, optical glass, silicon chip processing, magnetic materials processing, ceramics processin, gemstone processing ect.Imformation of the polishing carrier:Numbers of gears170Thickness0.525—0.575mmMaterialEpoxy boardDiameters of inside turn & outside turnReference the image below Package 20B007Amount50 piecesInner packing Polybag61×68(cm)Outer packing Carton54×54×5(cm) The specifications are only for reference, custom specification manufactures are welcomed. If you have any needs, We can produce according to your request for your products, please just Send An Enquiry to us, you will receive our prompt reply within 24 hours.